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[Software]High Bandwidth Memory: HBM3 is twice as fast as HBM2e, up to 819 GB/s per stack


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High Bandwidth Memory: HBM3 is twice as fast as HBM2e, up to 819 GB/s per stack

In a nutshell: JEDEC has announced the HBM3 standard. And, like any good revision to a memory standard, it features a minor decrease in voltage, a slew of added conveniences, and a doubling of all the performance-related specifications. Bandwidth? doubled. Layers? doubled. Capacity? doubled.

In numbers, an HBM3 stack can reach 819 GB/s of bandwidth and have 64 GB of capacity. In comparison, the HBM2e stacks used by the AMD MI250 have half the bandwidth, 410 GB/s, and a quarter of the capacity, a mere 16 GB.

At eight stacks, the MI250 has a total of 128 GB and 3277 GB/s of bandwidth. Eight stacks of HBM3 would have 512 GB with 6552 GB/s of bandwidth.

HBM3 also doubles the number of independent channels, from eight to 16. And it’s introducing "pseudo-channels" that allow it to support up to 32 virtual channels.

According to JEDEC, HBM3 additionally addresses the "market need for high platform-level RAS (reliability, availability, serviceability)" with "strong, symbol-based ECC on-die, as well as real-time error reporting and transparency."

JEDEC expects the first generation of HBM3 products to appear on the market soon but notes that they won’t meet the maximum specification. A more realistic outlook, it says, would be 2 GB modules in 12-layer stacks.

https://www.techspot.com/news/93182-hbm3-twice-fast-hbm2e-up-819-gbs-stack.html

 

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