[Hardware] Apple updates Leadership page to name John Ternus as SVP Hardware Engineering

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Apple earlier this week updated its Leadership page to feature John Ternus as the Senior Vice President, Hardware Engineering. Ternus was named successor to senior executive Dan Riccio, who is said to be spearheading the company’s Augmented Reality and Virtual Reality projects.

According to Apple’s website, Jon Ternus will report to company CEO Tim Cook. Ternus would lead all hardware engineering at Apple, including the teams responsible for iPhone, iPad, Mac, AirPods, and more.

The company also gives a brief overview of Ternus’ stint at Apple so far.

Before joining Apple, Ternus was a mechanical engineer at Virtual Research Systems. He had joined Apple’s Product Design team in 2001. He served as a vice president of Hardware Engineering since 2013. Apple also mentions Ternus as a key leader in the ongoing transition of the Mac to Apple silicon.

“Throughout his tenure at Apple, John has overseen hardware engineering work on a variety of groundbreaking products including every generation and model of iPad, the latest iPhone lineup, and AirPods,” according to the website.

Bonus: iPhone SE 2022, 2023 rumours

Apple is said to be preparing for an upgraded 2022 iteration of its compact iPhone SE. Conveniently dubbed as iPhone SE 2022, the handset will feature a 4.7-inch LCD. The 2023 model could be even bigger with a 6.1-inch display, according to leakster Ross Young.

The leakster also claimed that the 2023 version of the iPhone SE would have a punch-hole display. The iPhone SE 2022 is also rumoured to come with 5G support. As of now, Apple’s iPhone 12 series comes with 5G connectivity. Another interesting leak is that iPhone SE 2023 will come with a punch-hole display, moving away from the current boat-shaped notches on premium iPhones.

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