[Hardware] The new CPUs and GPUs go through a company, how do they see the future?

[WilkerCSBD]

Although we always talk about Intel, AMD, NVIDIA, Qualcomm and other companies in the semiconductor sector, the reality is that although they take the credit that the final product gives to the consumer, all of them, without exception, depend on a single company to be able to continue pushing in the industry. How does this company see the future of CPUs and GPUs? What news are you going to bring to the big manufacturers? and above all, when will he do it?

As we well know from the number of topics we have covered in this regard, it is ASML that has the upper hand and the one that sets the industry pace. The complexity and advancement of its scanners is of such a caliber that by sheer investment no one considers making them real and direct competition in the most advanced technology.

It is true that in most common scanners there is some competition, but in the rest, which is the important thing in semiconductors, ASML is alone and therefore knowing what it has prepared for us is synonymous with understanding how far Intel, AMD are going to go and NVIDIA.

ASML updated its roadmap with important news
ASML

The sections where the company is going to blow up the market once again will be divided this time into three very clear and differentiated: DUV systems, EUV systems and EUV High-NA systems.

Obviously, these three market options are aimed at different types of products, but the truth is that in all cases the DUV market is increasingly scarce and logically everyone is moving towards EUV so as not to really lag behind their competitors. The problem, as has been mentioned many times, is that the number of scanners is very limited annually, and although ASML is increasing the volume of production there is an open war to buy more units.

For this reason, in the three systems that we have named there are novelties, which will mark both the technologies, as well as the yields as well as the availability of wafers in production, crucial in the midst of the semiconductor crisis as we are living.

DUV systems
ASML-DUV

Although it seems strange, the reality is that both TSMC, Samsung or Intel continue to use DUV in a process mixed with EUV. As we know, wafers and chips are created in layers, so immersion technology is still needed in certain masks.

For this reason, ASML has presented its fourth generation of NXT scanners, specifically the new NXT: 2050i. Improvements focus on the new wafer handler, wafer stage, projection lens, laser pulse extender, and the immersion hood itself.

These improvements allow more accurate, faster measurements and a higher degree of wafer deflection correction, resulting in not only more functional chips being achieved, but also increasing throughput per hour (Wph) from 275 wafers to all 295 wafers.

This if we talk about ArFi technology (immersion), but if we talk about dry technology (ArF) the news is focused on a new NXT: 1470 that offers 300 WpH, being a little faster than its counterpart in ArFi, but that it will not become the best version of itself, since we talk about a second generation arriving with the same name and a performance of 330 WpH.

This will prevent to some extent that the supply is so scarce, the problem is that in the midst of the semiconductor crisis, leading companies such as those mentioned may settle for their current scanners in order to buy EUV.

EUV at 0.33 NA
EUV-SYSTEM

Or just EUV, since we are at this wavelength today. Intel already has scanners with this technology and length, as obviously Samsung and of course TSMC, where the 7 nm + and 5 nm among others will come from there, as well as the 1z RAM of the Koreans.

We have been with the NXE: 3400C scanners for a year and a half and now in full shortage ASML announces the new NXE: 3600D, which are already in the reservation process and will be shipped from the end of this year if all goes well.

ASML-Transmission

The improvements are not clear in this regard, there is a bit of controversy and speculation because the scanner arrives with some delay, but if we have to quote something, the rumored states that it will have more power, better optics, a faster phase change and it will be adapted. to the 3 nm system and below.

This is also without counting the increase in WpH, since we went from 135 in the already veteran NXE: 3400C to 160 in the new NXE: 3600D scanner.

The sections where the company is going to blow up the market once again will be divided this time into three very clear and differentiated: DUV systems, EUV systems and EUV High-NA systems.

Obviously, these three market options are aimed at different types of products, but the truth is that in all cases the DUV market is increasingly scarce and logically everyone is moving towards EUV so as not to really lag behind their competitors. The problem, as has been mentioned many times, is that the number of scanners is very limited annually, and although ASML is increasing the volume of production there is an open war to buy more units.

For this reason, in the three systems that we have named there are novelties, which will mark both the technologies, as well as the yields as well as the availability of wafers in production, crucial in the midst of the semiconductor crisis as we are living.

DUV systems
ASML-DUV

Although it seems strange, the reality is that both TSMC, Samsung or Intel continue to use DUV in a process mixed with EUV. As we know, wafers and chips are created in layers, so immersion technology is still needed in certain masks.

For this reason, ASML has presented its fourth generation of NXT scanners, specifically the new NXT: 2050i. Improvements focus on the new wafer handler, wafer stage, projection lens, laser pulse extender, and the immersion hood itself.

These improvements allow more accurate, faster measurements and a higher degree of wafer deflection correction, resulting in not only more functional chips being achieved, but also increasing throughput per hour (Wph) from 275 wafers to all 295 wafers.

This if we talk about ArFi technology (immersion), but if we talk about dry technology (ArF) the news is focused on a new NXT: 1470 that offers 300 WpH, being a little faster than its counterpart in ArFi, but that it will not become the best version of itself, since we talk about a second generation arriving with the same name and a performance of 330 WpH.

This will prevent to some extent that the supply is so scarce, the problem is that in the midst of the semiconductor crisis, leading companies such as those mentioned may settle for their current scanners in order to buy EUV.

EUV at 0.33 NA

EUV-SYSTEM

Or just EUV, since we are at this wavelength today. Intel already has scanners with this technology and length, as obviously Samsung and of course TSMC, where the 7 nm + and 5 nm among others will come from there, as well as the 1z RAM of the Koreans.

We have been with the NXE: 3400C scanners for a year and a half and now in full shortage ASML announces the new NXE: 3600D, which are already in the reservation process and will be shipped from the end of this year if all goes well.

ASML-Transmission

The improvements are not clear in this regard, there is a bit of controversy and speculation because the scanner arrives with some delay, but if we have to quote something, the rumored states that it will have more power, better optics, a faster phase change and it will be adapted. to the 3 nm system and below.

This is also without counting the increase in WpH, since we went from 135 in the already veteran NXE: 3400C to 160 in the new NXE: 3600D scanner.

EUV High-NA 0.55

ASML-Wafer-EUV

The high wavelength for EUV was a challenge not so long ago and is now more of a tangible reality than anything else. The slide shows this, with a WpH of between 185 and 150 depending on the mj / cm2 applied to it for the engraving.

The news is not known, there are not even leaks regarding how it has managed to reach and climb up to 0.55 NA, but we do have an arrival date for the EXE scanners: 5000 and especially the new EXE: 5200 that will arrive in 2025 and 2026, depending on how wavelength techniques evolve.

We know that 0.33NA can record at a 30nm pitch with a single exposure, while work is underway to lower that figure to 28nm and possibly end-of-life to 26nm, at least in multiple patterns.

ASML-High-NA-4ASML-High-NA-3ASML-High-NA-2ASML-High-NA-1
This can also produce the 3 nm of TSMC with the so-called Multi Pattern, but from there it is not believed that they can be reduced without longer wavelength. To such an extent everything is complicated, that the new scanners will be needed and those recorded with them will have to be directly double-patterned, at least for the 2 nm of TSMC and the 5 nm of Intel.

But equally, although the difficulty is greater, the performance will also be by scanner, since they are working on EUV masks with greater capacity and absorbent layers, also on improving photo-resistant ones, a key piece for a more perfect engraving.

So the future doesn't look easy, but at least ASML has new scanners in mind and design.