Nexy

** (Disclaimer: This video content is intended for educational and informational purposes only) ** The NOPD on February 4, 2020 released to media video footage captured from officer’s body worn and dashboard cameras during an officer-involved shooting incident on January 25, 2020. The video, released under the department’s protocol regarding instances of officer-involved shootings, clearly shows how quickly events unfolded from the time NOPD officers first arrived at the scene to the moment when the use of deadly force was required. At 7:26 a.m. on January 25, NOPD received multiple calls of an intoxicated subject pointing a firearm at random individuals in the area of Bourbon and St. Louis streets. People fleeing the scene flagged down responding officers and directed them to the armed subject, later identified as 25-year-old Austin Bentel, who was heard and observed to be screaming and shouting profanities as he walked along the street.

Kioxia Corporation, an industry-leader in-memory solution, has announced that it has successfully developed its fifth-generation BiCS FLASH three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia has plans to start shipping samples of the new device, which has a 64 gigabyte (512 gigabits) capacity with 3-bit-per-cell (or TLC) technology for specific applications in the first quarter of this year. Kioxia Corporation has announced they have developed the fifth-generation of BiCS Flash 3D memory, which utilizes a 112-layer vertically stacked structure. This new device aims to fulfill an ever-growing bit demands for a wide variety of applications this includes traditional mobile devices, consumer and enterprise SSDs, emerging applications enabled by the new 5G networks, artificial intelligence and autonomous vehicles. Kioxia is planning to apply this newer generation (the Fifth Generation ) of process technology to larger devices like a 1 Terabit, or 128 Gigabit, and 1.33 Terabit 4-bit-per-cell (or quadruple-level cell, QLC) devices. This 112-layer stacking process technology is combined with advanced circuit and manufacturing process technology to increase cell array density by approximately 20% over the 96-layer stacking process. The new technology reduces the cost and increases the manufacturability of memory capacity per silicon wafer; this newer technology also improves interface speed by 50% and offer higher programming performance and shorter read latency. This generation of the BiCS Flash was developed jointly with technology and manufacturing partner Western Digital Corporation, and this generation will be manufactured at Kioxia's Yokkaichi Plant and the newly built Kitakami Plant. Kioxia is a world leader in memory solutions, Kioxia has been dedicated to the development, production, and sale of flash memory and solid-state drives (SSDs). In 2017, the predecessor to Kioxia, Toshiba Memory, was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Kioxia has been dedicated to uplifting the world with memory by offering products, services, and systems that create choices for customers and memory-based value for society. Kioxia's innovative 3D flash memory technology, BiCS Flash, a memory that Kioxia has been developing and promoting. This has led to BiCS Flash is shaping the future of storage in higher density application; this includes the ever-advancing smartphones, PCs, SSDs, and data centers.

@REVAN

The winner is me with 8 votes (V2) /TC.

V1; V2; Start voting.

> Opponent's nickname: @Flenn. > Theme (must be an image): > Work Type: Avatar > Size & Texts: 150x250, Text: Ryu > How many votes?: 15 > Work time: 13h

Requirements: MINIMUM: OS: 64-bit Windows 7 / Windows 10 Processor: Intel Core i5-750, 2.66 GHz / AMD Phenom II X4 965, 3.4 GHz or AMD Ryzen™ 3 1200, 3.1 GHz Memory: 8 GB RAM Graphics: NVIDIA® GeForce™ GTX 670 or NVIDIA® GeForce™ GTX 1050 / AMD® Radeon™ HD 7950 or AMD® Radeon™ R9 270 DirectX: Version 11 Network: Broadband Internet connection Name game: Mortal Combat 11 Price: 23,99€ Link store: https://store.steampowered.com/app/976310/Mortal_Kombat11/ Offer ends 7 February

Linux and macOS systems have been hit by a nasty little bug in the Sudo utility, although the good news is it has already been patched. Sudo is a tool that provides a specified user permissions above their normal levels, including root (administrative) access, but by leveraging this security flaw, it’s possible a low-privileged user (or malware) could get unauthorized root access, and thus potentially wreak all sorts of havoc on the host system. Shlayer malware puts thousands of macOS devices at risk The best Linux distros of 2020 for beginners and advanced users And here are the best Linux laptops of 2020 An Apple security expert, Joe Vennix, discovered the bug, and it’s not the first he has pinned down. Back in October 2019, Vennix drew attention to another Sudo flaw that potentially allowed any user to run commands as root. Memory problems: The fresh vulnerability (codenamed CVE-2019-18634) relates to Sudo incorrectly handling memory operations when the ‘pwfeedback’ option is enabled in the Sudoers configuration file, as The Hacker News reports. Essentially, when a password is requested, this security measure can be bypassed via a large input that triggers a buffer overflow. Now, it’s often the case that pwfeedback isn’t enabled by default, but some operating system do have it active off-the-bat in Sudo – for example Linux Mint. Further note that the buffer overflow flaw only affects Sudo versions previous to 1.8.26. Sudo has already been patched to defend against the exploit with version 1.8.31 (versions 1.8.26 onwards are safe anyway, as the result of another previous change – even though the bug is still present, it can’t actually be leveraged). Apple also released a patch for macOS on January 28 to fix the problem, and it’s available for macOS High Sierra 10.13.6, Mojave 10.14.6, and Catalina 10.15.2.

ASUS recently showed a new firmware for the RS700A-E9-RS12V2 1U server, and this update has unannounced AMD EPYC (codenamed Rome) processors, Twitter user @momomo_us first noticed this document. Just like any other EPYC 7002 Series family, these chips utilize the latest Zen 2 microarchitecture and are manufactured at TSMC under the 7 nm FinFET process node. This processor also supports eight channels of DDR4 RAM and provides up to 128 high-speed PCIe 4.0 lanes. ASUS's new firmware supports unlisted EPYC processor that AMD hasn't announced yet! The EPYC 7662 has a total of 64 cores and 128 threads, and this 64-core chip has 256 MB of L3 cache, a 2.00 GHz base clock. The boost clock of this chip has not been released, but the thermal design power (TDP) of this chip is 200-watts. Looking at the 32-core chip, the EPYC 7532, has a total of 64 threads, a base clock of 2.40 GHz. This 32-core chip has the same L3 Cache and TDP of the EPYC 7662. The third unannounced EPYC processor is the EPYC 7F52, this processor has a total of 16-cores, 32-threads and offers a base clock of 3.50 while keeping the same amount of L3 cache. One difference in this chip is that the TDP is higher when compared to the other two processors, this processor's TDP is 240-watts. According to the ASUS' documents, the EPYC 7F52 has double the amount of the L3 cache when compared to the other 16-core processors, the EPYC 7302 being a prime example having just 128 MB of L3 cache. The last unannounced EPYC processor that was shown off in the ASUS firmware update is the EPYC 7F32 which offers the performance of 8-cores and 16-threads, this processor has a base clock of 3.70 GHz and is only one of these four processors to provide a different L3 cache, this processor L3 cache 128 MB. This processor will be the fastest eight-core processor in the EPYC 7002 Series lineup. This processor's TDP is significantly less than the other three processors, this processor's TDP is 180-watts. The firmware that supports the four unannounced EPYC processors is already out, so the processor should be announced very soon. The U.S. retailer Bottom Line Telecommunications already listed the EPYC 7662 and the EPYC 7532 for $6,653.81 and $3,634.77, respectively.

The winner is me with 8 votes (V1).

The Intel Core i9-10900K is next in line to replace the i9-9900K. And as spotted by Twitter user @_rogame, it recently landed in the 3DMark database. Based on the Comet Lake microarchitecture, the i9-10900K could be the last flagship processor to come out of Intel's 14nm process node. The processor has 10 cores, 20 threads, and rumors point to a 20MB cache. The 3DMark result detected the i9-10900K with a 3.7 GHz base clock and 5.1 GHz boost clock, which coincide with the figures from a previous leak. The 5.1 GHz reportedly corresponds to the 10-core chip's single-core boost clock. However, the i9-10900K is rumored to exploit Intel's Turbo Boost Max Technology 3.0 and Thermal Velocity Boost (TVB) features, which will enable it to boost to 5.2 GHz and 5.3 GHz, respectively. The i9-10900K will only fit inside Intel's new LGA1200 socket, so it will require you to buy a new motherboard based on one of the 400-series chipsets. However, you will be able to reuse your cooling solution since CPU coolers that support the LGA115x socket should work fine on the LGA1200 socket since both seeming have identical dimensions and mounting holes. That should be the least of your worries though. The big question is whether your CPU cooler can handle the i9-10900K's hotness. One early report suggests that the i9-10900K's maximum power consumption is off the charts. When pushed to the limit, the 10-core chip is rumored to draw over 300W. That's a jaw-dropping number considering that would put the i9-10900K's power consumption in the same ballpark of the AMD Ryzen Threadripper 3970X 32-core monster. Intel is expected lo launch the Comet Lake desktop processors in the middle of April. It won't be long before we see whether the chipmaker was successful in optimizing the i9-10900K's power consumption to a reasonable limit.

Accepted!!

The deadline to get a free upgrade to Windows 10 has sadly now passed. Not to worry though as you can rely on TechRadar to help you buy Windows 10 for the best price. Windows 10 brings back the beloved Start button as well as all the features and integrations you've come to expect from your PC. So, if you're building a brand new system or want to upgrade to Windows 10 on an older device, you're going to need to buy Windows again. Don't worry though, because we check the prices of Windows 10 every day to make sure you get the best deals. Why buy Windows 10? You may still be running your computer on Windows 7 or 8, and if so it might be time to buy Windows 10. This isn't just a performance update, Windows 10 brings new features and security settings to your machine that are crucial to getting your work done in today's operating systems. From the ease of the Cortana assistant to the speed boost you'll notice instantly, upgrading your older system to Windows 10 will be well worth your while. Windows 10 Home is the version that most people will need. It's for home use and includes game streaming from Xbox One and other consumer features like Cortana, as well as Windows Hello for logging into your PC via a fingerprint scanner or your face. If Windows 8 was the steepest learning curve imaginable, Windows 10 is like meeting a great friend you once knew again - it's just that they've bought some new clothes of which you really do approve. If you're looking to buy Windows 10 Home today, you'll find some excellent offers to save you some cash below.

AMD will be renewing their “Raise the Game” offer in February, with a new lineup of free games for those who buy Radeon RX 5000 series graphics cards. Previously, AMD offered games like Borderlands 3, Ghost Recon Breakpoint, and The Outer Worlds for those who bought RX 5000 cards or Ryzen processors. That offer ended on December 31 (with participants having until January 31 to redeem codes), but it seems the promotion was successful enough to do again. While AMD hasn’t officially announced the new Raise the Game promotion, VideoCardz apparently has the early details. If you purchase a Radeon RX 5700 or 5700 XT you’ll get Resident Evil 3 and Monster Hunter World: Iceborne, while those who buy an RX 5500 XT will get Resident Evil 3, Warcraft III: Reforged, and Ghost Recon Breakpoint. Meanwhile, all purchases of RX 500 and 5000 graphics cards will get a free three-month subscription to Xbox Game Pass. And no, your eyes aren't deceiving you -- it seems the RX 5600 XT is left out of this promotion. Why that is, I have no idea. Maybe it’s just an oversight and the 5600 will be included once the promotion is officially announced (we also don’t know whether Ryzen processors will be included this time around). This is definitely a pretty good deal for those looking to invest in a high-end graphics card. Sure, graphics cards can be expensive, but nearly $200 of free games is nothing to sniff at. Here’s hoping AMD continues these offers on a semi-regular basis. The latest Raise the Game promotion reportedly kicks off on February 4 and will continue until April 25. Those who pick up a qualifying card will have until May 25 to cash in their free game codes. What do you think? Do these kind of promotions actually sway your purchasing decisions?

** (Disclaimer: This video content is intended for educational and informational purposes only) ** At about 10:57 a.m. Monday, one of or officers attempted to conduct a traffic stop on this van at the intersection of South Clara and West Beresford Avenue after it had run a stop sign. The tag on the van also back as stolen out of Orange County. The van, however, did not stop. It was spotted a short time later by Volusia County Air 1 helicopter on South Garfield Avenue and then traveled eastbound on International Speedway Boulevard before making a U-Turn and rolling over and crashing. A subsequent search of the vehicle found multiple types of prescription pills and heroin. A small dog in the vehicle escaped the crash unharmed and was turned over to Daytona Beach Animal Control. The driver, Sarah Yurman, was injured in the crash and was taken to Halifax Health Medical Center in Daytona Beach. Upon her release she will be facing multiple charges including attempted fleeing and eluding law enforcement and narcotics charges.

The macOS Mojave brings key iOS apps like News and Stocks to our best Macs, as well as amazing features like the system-wide Dark Mode and boosted productivity via Finder. It’s hardly a surprise, therefore, that many of us – even those who can upgrade to macOS Catalina – are still sticking with it. Especially those who don’t want to move on from iTunes, which the new operating system replaces with several new apps. Beyond that, there’s a lot to love about the macOS Mojave. Despite its own fair share of security issues, most notoriously KeySteal, the operating system is generally safe and secure. And, many of those concerns have been addressed, making this operating system better than ever. Besides, any persisting issues are dwarfed by the many advantages this new OS brings to the table. Let’s dig further into everything the macOS Mojave can do, so that you can take full advantage of its features and also decide whether to stay with it or upgrade to macOS Catalina. Make the most out of the new operating system with the best macOS 10.14 Mojave tips and tricks Installed Mojave and having issues? Check out our guide on macOS 10.14 Mojave problems: how to fix them Cut to the chase What is it? The 2018 edition of Apple’s Mac operating system, macOS When is it out? macOS Mojave is out right now What will it cost? macOS 10.14 is free Apple unveiled macOS 10.14 Mojave back in June 2018 at the WWDC 2018 event, and during that time, many of its features were showcased. This announcement was then followed by a public beta launch in July 2018. Finally, a full launch of the operating system happened on September 24, 2018. Apple has been keeping macOS 10.14 Mojave up to date with all the latest features. The newest of these updates, macOS 10.14.4, brought Dark Mode to Safari, alongside the Apple News+ service. Previous updates included a fix for the FaceTime Bug, which allowed other people to access your camera without you taking their call or giving them permission, as well as a supplemental update to boost reliability for the 2018 MacBook Air. Apple has also rolled out macOS 10.14.5, though it isn’t the last major update to the operating system before macOS 10.15 is released. This update concentrated on stability, and is still very much worth downloading despite only touting more nuanced improvements. Since macOS 10.14 Mojave has been available for some time now, there are a lot of new features to discover and take advantage of. Let’s dig into the best ones and do a run-down of everything your Mac can do. From Finder enhancements to stricter security, the best Macs are about to become all the better. Read on to find out all the fresh features macOS Mojave brings to the table, whether or not you haven’t made the jump yet, so you know all the incredible things this operating system lets you do. Perhaps its most impressive feature is the system-wide Dark Mode. Apple’s macOS 10.14 Mojave brings in a very exciting feature in a dark mode that covers every first-party program on the Mac. Even Xcode gets the look, completely in black, making those protracted programming sessions easier on the eyes. Third party applications are also starting to adopt this new theme, with changes happening automatically for any app that uses standard colors through AppKit. Although, developers who don’t use AppKit are also working on implementing Dark Mode on their applications. For example, in a recent bug report, Google Chrome developers confirmed that they’re working on bringing Dark Mode into its fan-favorite web browser – just as soon as they iron out some issues first. Group FaceTime One of the marquee features that was part of the initial launch of MacOS Mojave, Group FaceTime was rolled out to the public as part of macOS 10.14.1. This nifty feature lets you to have FaceTime conversations with up to 32 people across iOS and macOS devices. Group FaceTime has an incredibly intuitive implementation in macOS 10.14 Mojave. You can start a group FaceTime chat from any group iMessage thread, and invites are sent through a ringless notification so as not to distract anyone you’re trying to invite. Once a Group FaceTime Chat has started, it automatically detects the person speaking, bringing them front and center so that everyone’s attention is always on the person actively speaking.

I’m pretty sure that the next time I go to a trade show where new silicon is being announced, the next tool I need in my backpack is a set of calipers in order to measure the die size. While die size doesn’t in of itself mean much as a number on its own, it is the end result of lots of hard work, focused co-design between silicon engineers and the semiconductor fabs, and ultimately there’s a fine balance between features, die size, performance, power, and at the end of the day, cost. With AMD showcasing the first x86-based 8-core CPU to move into the 15 W power envelope, finding out the die size is one of the elements of our investigation into how AMD has created its new Renoir / Ryzen Mobile 4000 product. When I first saw the silicon, I wasn’t able to take pictures. Instead, I had to guess the size by manually placing it next to a 8-core Zen 2 chiplet from AMD’s monster 64-core Threadripper 3990X. We’ve known the die size for a while now, at 10.32 x 7.34 mm, or 75.75 mm2. My guess at the time that the new Renoir APU was almost exactly double the Zen 2 chiplet, and I mean it was scary how close to double the size it was. At the time of the announcement of Ryzen Mobile 4000, I had stated in our article that I estimated 150 mm2 for the die size. Turns out, I wasn’t too far wrong. Later at CES, I went up to the AMD booth and this time they were more than happy for me to take photographs of the new silicon. The 3990X was also there, so I could place the two side by side and get a reasonable reference photograph on which to do calculations. This is the point of the event where I should have remembered to bring calipers! Taking photographs of chips is actually quite hard, making sure you get them lined up perfectly to get the same perspective, but also having enough light to get clear defined silicon edges. In our picture, the Renoir chiplet you may notice is very slightly angled to the camera, which we’ve compensated for in our measurements. With that in mind, here are our numbers. The Zen 2 chiplet on the left, measures 10.32 mm by 7.34 mm, which is a ratio of 1.406 to 1. In our image, the chiplet measured 265 pixels by 189 pixels, which is a ratio of 1.402 to 1. In our image, the Renoir SoC measured 282 pixels by 350 pixels, which is a ratio of 0.806 to 1. If we take the corresponding pixel dimensions, that gives us 10.98 mm by 13.59 mm, a ratio of 0.808 to 1. This means that the die size of an eight-core Renoir APU with eight 2nd Gen Vega compute units, according to our calculations, 149.27 mm2. That’s pretty close to my 150 mm2 estimate, and I’ve also spoken to a few trusted individuals who have been tracking Zen 2 die structure sizes and graphics structure sizes, and they came out very similar, within 1mm2 or so. At 149.27 mm2, assuming that AMD is achieving the same defect ratio on the silicon as reported by TSMC for the standard N7 process (0.09 defects per cm2), the process yield should be around 90%. Obviously that doesn’t take into account manufacturing for yield, or the distribution of the power/frequency of the chips within a wafer, but it’s still rather impressive. Before AMD announced this new chip, there was a good deal of speculation as to how AMD would build it: either four cores with more graphics, or with eight cores and graphics only a little better. One factor of that was the die size: at 200 mm2, one would have expected AMD to definitely use eight cores. For sub 125 mm2, in order to maintain GPU performance, perhaps a quad-core design only have been suitable. However, AMD is claiming a great win here: eight Zen 2 cores, with frequencies at 1.8-4.3 GHz at 15 W, and despite fewer graphics compute units (down from 11 to 8), a higher per-compute unit performance claim of +56% means that performance is actually higher. All just shy of 150 mm2. We are living in the future. I can’t wait for more. It's worth noting that AMD's official number for the Zen 2 die size is 74 mm2. This is derived from the floorplan of the chip, which during manufacturing has additional space added to ensure clean die seperation between adjacent die prints. Ultimately what we get as the consumer is that seperation lane (known as a scribe lane) from one side of the die to the other, which is just slightly bigger than the floor plan that AMD supplies to the fabrication plant / TSMC. With calipers, what we get is that additional space, which is above AMD's quoted size.

Requirements: MINIMUM: Requires a 64-bit processor and operating system OS: Windows Vista 64-bit or newer Processor: Intel Core i3-2100T @ 2.50 GHz / AMD Phenom II X3 B73 Memory: 4 GB RAM Graphics: DirectX 11 Compatible Storage: 45 GB available space Sound Card: DirectX Compatible Sound Card Name game: Pillars of Eternity II: Deadfire Price: $24.99 USD Link store: https://store.steampowered.com/app/560130/Pillars_of_Eternity_II_Deadfire/ Offer ends after 48h